How Huawei Is Trying to Make 2nm Chips Without EUV

Описание: #huaweichips #asml #euv
How Huawei Is Trying to Make 2nm Chips Without EUV
Can you really design a 2-nanometer chip without EUV lithography?
Huawei has filed a detailed semiconductor patent that outlines a possible path to 2nm-class logic chips without access to ASML’s EUV machines — something long considered impossible by much of the industry.
In this video, we break down what Huawei’s 2nm patent actually claims, how DUV immersion lithography and advanced multipatterning could theoretically be pushed beyond their limits, and why this approach is technically valid but economically risky.
We explain:
• Why EUV lithography (13.5nm wavelength) is considered mandatory below 3nm
• How Self-Aligned Patterning (SAP / SAQP) works as an alternative
• Why BEOL interconnect technology is now a major bottleneck at advanced nodes
• The role of exotic metals like ruthenium, cobalt, and next-gen tungsten
• Why this patent does NOT mean mass-production 2nm chips today
• And what this means for ASML, TSMC, Samsung, Intel, and the global semiconductor race
This is not hype, and it’s not propaganda.
It’s a realistic engineering analysis of what happens when a company is locked out of EUV and forced to explore costly, low-yield alternatives just to stay technologically relevant.
If you care about how chips are actually built, not headlines, this breakdown is for you.
If you value engineering over hype, consider subscribing.
And if this helped you understand what’s really going on in advanced chipmaking, share it with someone who follows semiconductors or geopolitics.

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