CASES: System Level Design: Interconnect and 3D Stacking
Автор: Embedded Systems Week (ESWEEK)
Загружено: 2022-10-14
Просмотров: 132
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Talks -
Title: GCIM: Towards Efficient Processing of Graph Convolutional Networks in 3D-Stacked Memory
Author: Jiaxian Chen (Shenzhen University); Yiquan Lin (Shenzhen University); Kaoyi Sun (Shenzhen University); Jiexin Chen (Shenzhen University); Chenlin Ma (Shenzhen University); Rui Mao (Shenzhen University); Yi Wang (Shenzhen University)
Title: Accelerating Large-Scale Graph Neural Network Training on Crossbar Diet
Author: Chukwufumnanya Ogbogu (Washington State University); Aqeeb Iqbal Arka (Washington State University); Biresh Kumar Joardar (Duke University); Janardhan Rao Doppa (Washington State University); Hai (Helen) Li (Duke University); Krishnendu Chakrabarty (Duke University); Partha Pratim Pande (Washington State University)
Title: Work-in-Progress: RISC-V Based Low-Cost Embedded Trace Processing System
Author: Xiao Hu (National University of Defense Technology); Yaohua Wang (National University of Defense Technology); Xuan Gao (National University of Defense Technology)
Title: Work-in-Progress: Emulation of Biological Tissues on an FPGA
Author: Jerry Jacob (University of Auckland), Sucheta Sehgal (University of Auckland), Nitish Patel (University of Auckland)
Title: Work-in-Progress: MLGOPerf: An ML Guided Inliner to Optimize Performance
Author: Amir H. Ashouri (Huawei Technologies); Mostafa Elhoushi (Huawei Technologies); Yuzhe Hua (Huawei Technologies); Xiang Wang (Huawei Technologies); Muhammad Asif Manzoor (Huawei Technologies); Bryan Chan (Huawei Technologies); Yaoqing Gao (Huawei Technologies)
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