SNAPSIL™ TSE6340 CIPG Liquid Silicone Adhesive
Автор: MomentiveChannel
Загружено: 2024-10-09
Просмотров: 449
Описание:
SNAPSIL TSE6340 is a two-component, heat cure liquid silicone CIPG (Cure In Place Gasket) adhesive. This material cures in a short period of time at temperature to enable fast processing. This material is a good candidate to consider in order to allow serviceability of high- end electronics assemblies. Its non-slumping, pasty consistency can provide physical stability for optimized gasket designs.
Key Features and Typical Benefits:
Fast, low temperature cure
Convenient 1:1 mix ratio by weight
Non corrosive
Low odor
Typical applications for TSE6340 include sealing for electronic components in automotive, consumer, telecommunication, lighting and industrial applications
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