Surface Mount Assembly Process from Distron Corporation
Автор: Distron Corporation
Загружено: 2014-05-16
Просмотров: 2830
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Visit us online at http://www.distron.com/surface-mount-...
The surface mount assembly process begins with the solder paste application process. We use a deck horizon automated printer which uses a vision system which can accurately align the stencil to the printed circuit board. After solder paste printing the boards go through a Mydata flexible pick and place machine which in total can place approximately 80,000 components per hour.
After pick and place the boards go through a convection re-flow soldering process. This is a 9 zone oven which creates the mechanical and electrical bond between the printed circuit board. After re-flow soldering the boards go through automated optical inspection. We do 100% inspection which checks for component placement, skewing and solder inspection.
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