Signal Integrity Simulation
Автор: Ozen Engineering, Inc - A Member of SimuTech Group
Загружено: 2019-12-23
Просмотров: 2693
Описание:
Successful design of next-generation electronic products requires power integrity, signal integrity and thermal integrity co-analysis. SIwave uniquely handles the complexity of interconnect design from die-to-die across ICs, packages, connectors and boards. By leveraging advanced electromagnetic, thermal and mechanical simulators dynamically linked to powerful circuit and system simulation, you can understand the performance of high-speed electronic products long before building a prototype in hardware. This approach enables electronics companies to achieve a competitive advantage with faster time to market, reduced costs and improved system performance.
#Ozen #FEA #CFD #Digital_Twin #Consulting #Electromagnetic #Batteries #Simulation
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Contact us at:
https://www.ozeninc.com
(408) 732-4665
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