MIJING M21 UNIVERSAL MAGNETIC BASE MIDDLE LAYER BGA CPU IC REBOLL STAND|stencil stand |ic stand
Автор: mobileic
Загружено: 2023-12-20
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MIJING M21 UNIVERSAL MAGNET BASE FOR MOBILE PHONE BGA REBALL ING PLANTING TIN MAINTENANCE
DESCRIPTION
MIJING M21 UNIVERSAL MAGNETIC BASE MOBILE PHONE MOTHERBOARD MIDDLE LAYER FRAME REBALLING PLATFORM. MIJING UNIVERSAL MAGNETIC BASE WITH MAGNETIC STEEL MESH STENCIL AND SCRAPER BLADE TIN PASTE KNIFE FOR CELL PHONE LOGIC BOARD MIDDLE LAYER MID FRAME BGA TIN PLANTING REPAIR.
MIJING GX01 GX02 NON-MAGNETIC TIN PASTE SCRAPER KNIFE SET FOR MOTHERBOARD IC GLUE REMOVING TIN-PLANTING.
FEATURES:
1. TEMPERATURE RESISTANCE AND STRONG MAGNETISM.
2. TEMPERATURE-RESISTANT SILICONE MATERIAL, BUILT-IN STRONG MAGNETISM.
3. SUITABLE FOR MOBILE PHONE MOTHERBOARD MIDDLE LAYER, MIDDLE LAYER MANIA, BGA, TIN-PLANTING, ECT.
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