Bunch of Wires (BoW) Die-to-Die Chiplet Demo
Автор: NextGenInfra
Загружено: 2023-01-28
Просмотров: 537
Описание:
At the first, annual Chiplet Summit in San Jose, California, d-Matrix demonstrated a die-to-die chipset interface based on the emerging Bunch of Wires (BoW) work undertaken by the Open Compute Project (OCP).
In this video, Wen-Sin Liew, Analog and Mixed Signal Design Engineer, shares an overview of the demo.
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